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PVD is the abbreviation of physical vapor deposition. PVD is the technology of material evaporation deposition in a vacuum state. The vacuum chamber is the necessary condition to avoid the reaction of evaporated material and air. PVD coating is used to prepare new products with added value and characteristics, such as brilliant color, wear resistance, and friction reduction. The PVD process is used to form the coating by condensing most of the metal materials and combining them with gases, such as nitrogen. The matrix material is transformed from solid-state to gas state and is ionized by heat energy as received in the arc process, or by kinetic energy as in the sputtering process. PVD technology is environmentally friendly and pollution-free. In general, Huicheng vacuum focuses on PVD coating.
The term “physical vapor deposition” (PVD) covers specific processes used in thin-film technology. In all cases, it refers to vacuum-based coating processes that use physical methods to deposit thin films on a substrate.
Of the various types, sputtering is one of the most economic deposition methods which is used as a standard coating technique in many industries. One of the main reasons for popularity of sputtering is the fact that this method allows for a multitude of different materials to be deposited on a wide variety of substrates.
Sputtering processes are used in different applications such as finishing surfaces in the semiconductor industry, producing polarization filters in the optical industry or coating large area surfaces in architectural glass industry.
Not only do we supply our customers with coating systems, but we also develop and produce sputtering targets and we have a great deal of expertise from our more than quarter a century of experience in this area.
In all PVD processes, the material from which the thin film will be produced is initially in solid form and normally located somewhere in the process chamber, e.g. at the target in sputtering. Various methods are used to vaporize the material (for example, using a short, powerful laser pulse, with an arc, or by ion or electron bombardment) which then condenses in the form of a thin film on the substrate.
Principle of vacuum coating glass machine
The principle of vacuum coating glass machine magnetron sputtering coating method is to use the film-forming material as the target, after a negative high voltage of 5 o V is applied to the cathode, when the vacuum degree reaches a certain level, a glow discharge plasma will be generated The sputtering gas passing through the vacuum chamber dissociates into positively charged ions and electrons. The positively charged gas ions are attracted by the cathode surface and impact the target, causing the target to emit atoms, which are then deposited on the glass surface, gradually accumulating To form a film, the magnetic field generated by the magnet binds the regenerated electrons emitted from the cathode surface, so that the magnetron opportunities for electrons and gas atoms are increased, and more ions are generated, which improves the sputtering speed.
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